Advanced electronic manufacturing capabilities designed for precision, consistency, and reliability.
Alica Technologies LLP offers structured and process-driven electronic manufacturing capabilities to support complex PCB assemblies and electronic products. Our facility integrates advanced SMT equipment, inspection systems, and controlled workflows to ensure accuracy, repeatability, and dependable output.
From fine-pitch component placement to multi-stage inspection, our capabilities are designed to meet demanding technical requirements across industries.
Our production lines support SMT, THT, and mixed-technology PCB assemblies with high placement accuracy and controlled soldering processes.
Assembly Capabilities Include:
– SMT & Thru-Hole PCB assembly
– Single-sided and double-sided boards
– Mixed-technology builds
– Leaded and lead-free processes
– Prototype to low/medium volume production
Our SMT lines are equipped to handle a wide range of components with high repeatability and accuracy.
Component Handling Range:
– 01005 package components
– BGA, QFN, CSP and fine-pitch ICs
– High-density PCB layouts
– Odd-form and specialty components
– Large ICs and multi-layer boards
Inspection is integrated at critical stages of our manufacturing workflow to ensure early defect detection and consistent quality output.
We provide testing services tailored to project-specific requirements to ensure assembled boards meet defined electrical and functional standards.
Testing Capabilities:
– Functional testing
– Voltage and impedance testing
– Custom testing setups (as required)
– Final verification before dispatch